MEMS

Micro-Electro-Mechanical Systems

MEMS (Micro-Electro-Mechanical Systems) consist of miniaturized mechanical and electro-mechanical elements which are manufactured using various deposition and etching techniques.  MEMS devices range in size from sub-micron to several millimeters and vary from relatively simple structures having no moving elements, to complex systems with many moving elements. These systems are interchangeably referred to as MEMS, microsystems or micromachined devices.

One of the primary family of MEMS structures are microsensors, which convert mechanical signals into electrical outputs. These miniature transducers measure temperature, acceleration, pressure, force, rotational velocity, humidity, sound, magnetic fields and other parameters.

4D AccuFiz Fizeau interferometers measure flatness and roughness of wafers.

NanoCam HD optical profilers measure roughness on coated and uncoated wafers. NanoCam HD can also measure the shape and shape change of wafer-level devices (such as microfluidics) and diced and packaged devices (such as micromirror arrays).